| 工艺 | SMT (0201 to 45 mm parts, 0.35 mm BGA pitch) and DIP, boards up to 400 × 510 mm |
|---|---|
| 测试 | SPI, AOI, X-ray, first article, functional test |
| 物料 | Full or partial component sourcing |
当前产线的常规能力。最终范围取决于你的叠层和设计评审。
| 工艺 | SMT (0201 to 45 mm parts, 0.35 mm BGA pitch) and DIP, boards up to 400 × 510 mm |
|---|---|
| 测试 | SPI, AOI, X-ray, first article, functional test |
| 物料 | Full or partial component sourcing |
当前产线的常规能力。最终范围取决于你的叠层和设计评审。